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Manufacturer Part No: 25EMPPC603E2BB200Z
Manufacturer: IBM
Category: Embedded Processors and Controllers
Description:
Package Description:
IBM 25EMPPC603E2BB200Z technical specifications and attributes
PART STATUS
Active
PACKAGING
Bulk
SERIES
SUPPLIER DEVICE PACKAGE
278-FCPBGA (21x21)
MOISTURE SENSITIVITY LEVEL MSL
3 (168 Hours)
ROHS STATUS
Not applicable
OPERATING TEMPERATURE
0°C ~ 105°C (TJ)
MOUNTING TYPE
Surface Mount
PACKAGE CASE
278-BBGA, FCBGA
CATEGORY
Microprocessors
ECCN
3A991A2
HTSUS
0000.00.0000